Activation with Plasma In the case of activation, the polymeric surface is exposed to plasma. Used for the plasma are inert gases (noble gases) of gases consistent of molecules which have no atoms who can build chains, such as Ar, N2, O2 or NH3. In this case the bonds in the surface are split and reactive areas are built due to the electrons, ions and high-energy radiation which is created by the plasma. The so created radicals can then react with each other and cause an additional cross linking on the surface. The so produced high cross linked surface is an activated surface. With gases which are not inert, such as N2 or O2, contained atoms can be imbedded ditionally in the surface and can cause a change in the surface properties of the substrates die to new functional groups.
Cleaning with plasma At the cleaning of surfaces using plasma, small remains of organic substances are removed. Normally a process of primary cleaning is applied before this cleaning. A sterile ultra pure cleaning with plasma is reached, if the parts which should be cleaned, are treated with oxygen plasma. The organic remains, which should be removed, react with the oxygen and the so produced gas is extracted with the vacuum pump. At some cases other process gases are used such as hydrogen or noble gases. That depends on the pollution or the properties of the substrates which should be cleaned.
Photo resist ashing The removal of photo resist layers is a process in the semi-conductor production, which is very often conducted. For this purpose our systems at micro wave basic have been proved particularly. They form a remarkably low priced and environmentally friendly alternative. Especially after etching of structures and at highly pressured varnishes this technology has proved itself. Even after implantation processes the benefits of micro waves can be used not only through high incineration rates. Mostly oxygen is used a process gas. Because of the high ionization grade and the properties of isotopes of micro wave plasma there is a particular gentle treatment of components and high removal rates. If your application needs a plasma activation using MHz, our systems are also available with MHz frequency. In the micro technology it is increasingly necessary to partly remove very thick varnish layers, which can be done successfully and notably low priced with our plasma equipment of series Q. For these applications our standard systems with silica glass chamber are available with a diameter of 150, 240 and 310 mm. Other dimensions are available on demand.