Search

AOI inspection X-Ray AOI SPI cleaning Cleaning machines / services Cleaning stencils ultrasonic Conformal coating Dispensing paste & Glue manualy Microscope PACE rework BGA PCB Milling and Drilling PCB separators pick&place Pick & Place manual Products Reflow ovens Reflow oven table top batch removal of coating Screen printer selective coating system selective solder SMD Pick&Place SMD Storage stensil printers Table top Table top Batch oven Wave solder machines workbenches heavy duty X-ray x-ray inspection

WP-Cumulus by Roy Tanck and Luke Morton requires Flash Player 9 or better.

Categories

Recent Posts

Screenprinter manual operated

SPR-25 Stencil Printer

The SPR-25 Stencil Printer provides fine X, Y, Z, and theta adjustments for exact stencil-to-board alignment resulting in precise, fine pitch printing of solder paste.APS Model SPR-25 Manual Stencil Printer

  • Dual squeegee for clean and convenient application of solder paste
  • Linear ball bearing guide assures smooth manual squeegee stroke with its unique adjustable angle-of-attack for precise single or dual direction printing
  • Fine X, Y, Z, and theta adjustments for exact stencil-to-board alignment
  • Adjustable frame holder compatible with any tubular or cast framed stencils up to 23” x 23” (584mm x 584mm) outside diameter
  • Easy to lift frame with gas strut assists
  • PCB vacuum hold-down option

 

Maximum print area: 16” x 18” (406mm x 457mm)
Adjusts to various size frames: Frame holder accepts any size stencil frame up to 23” x 23” (584mm x 584mm)
Adjustable dual squeegee pressure/speed: Manual
Vacuum hold-down option: Yes
Linear squeegee guide: Yes
Adjustable angle of attack: Yes

AOI batch inspection system BPC-168DT

machine_aoiAOI batch inspection system  BPC-168DT

 High Speed inspection 0.15 sec. per field of view 
  • Selectable resolution: 25, 18, 12 micron
  • Telecentric lens system
  • 8 lighting schemes can be used for inspection
  • 3 brightness levels of White LED
  • CCD camera with 145M pixel
  • Easy Operation

GW-UBF Universal Solder Fountain

GW-10A-HTGW-UBFSolder Fountain with Universal X, Y, & Z Board Fixture Option for board sizes up to 11″ x 16.5″ (280 x 420mm).

  • Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
  • 10 menu storage
  • Overhead locator laser light pinpoints position for centering components over the wave
  • Height ajustable stainless steel platform
  • Large selection of nozzles for all component sizes
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
  • Univeral X, Y, & Z Board Fixture Option for board sizes up to 11″ x 16.5″ (280 x 420mm)

 

Solder type: Standard Lead
Max solder temp: 527°F (275°C)
Solder capacity: Approx. 50 lbs (23Kg)
Blow-thru air nozzle: N/A
Compressed Air Req’d: N/A
Overall dimensions: 31” x 25.25” x 24.5” (787 x 641 x 622 mm)
Board Size: Universal X, Y, & Z Board Fixture Option for board sizes up to 11” x 16.5” (280 x 420mm)

GW-10A-HT Soldering Fountain

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.

  • GW-10A-HTMicroprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
  • 10 menu storage
  • Overhead locator laser light pinpoints position for centering components over the wave
  • Height ajustable stainless steel platform
  • Large selection of nozzles for all component sizes
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
  • “Blow-thru” hot air nozzle option removes solder remaining in through holes during rework process
  • High temperature (350°C), lead-free operation
  • Available in a Lead only version

 

Solder type: Hi-temp Lead-free
Max solder temp: 662°F (350°C)
Solder capacity: 50 lbs (23Kg)
Blow-thru air nozzle: N/A
Compressed Air Req’d: N/A
Overall dimensions: 16” x 26” x 17” (406mm x 660mm x 432mm)
Board Size: 8.5″ to 18″ (203mm to 457mm) L x 16″ (406mm) Depth

Spartan 8″ and 12″ (Double) Wave Soldering Machines

S8D-Stand

Automatic wave solder system with self-contained fluxing, preheating and laminar (smooth) solder wave modules.

  • Automatic wave solder system
  • Best value through cutting-edge technology
  • Ready-to-go fluxing, preheating and wave modules
  • Quick ROI (Return on Investment)
  • Exceptional accuracy and repeatability
  • Lead or Lead-Free solder compatibility
  • Easy to use
  • Low maintenance
  • Single (8S) and dual (8D) wave capability

Wave Width: 8″ (203mm)
Max Wave Height: 0-3/8″/0-10mm
Solder Pot Capacity: 125 lbs (57 kgs)
Solder Pot Power: 2.5 kw
Max Conveyor Speed: 6 ft/min (2m/min)
Foam Fluxer Tank: 0.5 gal (2 litres)
Compressed Air: Max 30 psi on system with air-knife only
Approx Warm-up Time: 40 min.
Max Preheat 1 Temp: 338°F (170°C)
Preheat 1 Power: 2.25 kw
Max Preheat 2 Temp: 428°F (220°C)
Preheat 2 Power: 1.5 kw
Preheat 3 Power: N/A
Next Page »