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GF-12 HC-HT Benchtop Reflow Oven

Reflow oven utilizing our 100% patented forced air Horizontal Convection™ Heating technology provides for greater thermal uniformity and process control. The GF-12HT is lead -free compatible for RoHS compliant soldering.

  • 100 menu profile storage
  • Lead-free solder reflow capable
  • System will handle board sizes up to 12″ (305mm) width
  • Real time graphic temperature profiler to assist in profiling of board
  • 26″ (660mm) long heating tunnel
  • Nitrogen gas inerting option available
  • Available in Lead (HC version) and Lead-free (HT version) reflow capable


Max board width: 12” (305mm)
Max board height: 1.375” (35mm)
Heating zones: 3 top, 3 bottom
Max temperature: HC: 250°C (482°F)HT: 350°C (662°F)
Heat tunnel length: 26” (660mm)
CyclonicsTM (forced air): Six (6)
Conveyor extensions: Option
Cooling station(s) : One (1)
Venting: 4” flange, 100 CFM max.
Cooling Zone Venting: N/A
Nitrogen option: Yes
PC Interface: Optional
Overall dimensions (L x W x H): 39” x 32” x 19”H (990mm x 813mm x 483mm)

Reflow oven FT 02

FT02 oven has been conceived to the reflow of solder paste and polymerization of the glues for prototyping.  FT02 oven is compatible with high temperature alloys and above all “lead free” ones thanks to its new heating system as well as its electronics.

It includes in line many functions as 10 programs memorization, information display upon LCD monitor, a wide viewing window to supervise the process. For a better safety, FT02 includes a double window with air circulation to avoid any burning risk as well as a blocking door opening to avoid any unwanted opening.  FT02

Key features:

• Complete view of the card thanks to a large windowf31114_ft02
• Compact model, but working area of 190 x 290 mm
• Heating through forced convection
• Temperature control by microprocessor
• Digital display of different advises: temperature and time
• Easy programming for immediate control
• Safety: double window with air circulation, closing door access
 

   
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