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GW-UBF Universal Solder Fountain

GW-10A-HTGW-UBFSolder Fountain with Universal X, Y, & Z Board Fixture Option for board sizes up to 11″ x 16.5″ (280 x 420mm).

  • Microprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
  • 10 menu storage
  • Overhead locator laser light pinpoints position for centering components over the wave
  • Height ajustable stainless steel platform
  • Large selection of nozzles for all component sizes
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
  • Univeral X, Y, & Z Board Fixture Option for board sizes up to 11″ x 16.5″ (280 x 420mm)

 

Solder type: Standard Lead
Max solder temp: 527°F (275°C)
Solder capacity: Approx. 50 lbs (23Kg)
Blow-thru air nozzle: N/A
Compressed Air Req’d: N/A
Overall dimensions: 31” x 25.25” x 24.5” (787 x 641 x 622 mm)
Board Size: Universal X, Y, & Z Board Fixture Option for board sizes up to 11” x 16.5” (280 x 420mm)

GW-10A-HT Soldering Fountain

High temperature, lead-free Solder Fountain with blow-thru air nozzle, used for removal and replacement of through-hole components, connectors, etc. mounted on PC boards.

  • GW-10A-HTMicroprocessor based digital controller that regulates solder temperature, wave height, and solder flow duration
  • 10 menu storage
  • Overhead locator laser light pinpoints position for centering components over the wave
  • Height ajustable stainless steel platform
  • Large selection of nozzles for all component sizes
  • Easy to change bayonet mount nozzles for a variety of rework or selective soldering applications
  • “Blow-thru” hot air nozzle option removes solder remaining in through holes during rework process
  • High temperature (350°C), lead-free operation
  • Available in a Lead only version

 

Solder type: Hi-temp Lead-free
Max solder temp: 662°F (350°C)
Solder capacity: 50 lbs (23Kg)
Blow-thru air nozzle: N/A
Compressed Air Req’d: N/A
Overall dimensions: 16” x 26” x 17” (406mm x 660mm x 432mm)
Board Size: 8.5″ to 18″ (203mm to 457mm) L x 16″ (406mm) Depth

Selective solder wave

Key facts Distill the soldering process to its most simple and dependable elements. Small, simple, rugged, reliable, easy-to-use machines designed for selective soldering of components. Ideal for soldering of through-hole components into surface mount boards after the reflow process without disturbing neighboring components. The special features All possible aplications you can find on the wesite www.ace-protech.com  

Or send us an e-mail: info@fixtrade.nl

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